✍ 目的：為邀請更多優秀學者參與半導體相關領域研究，台積公司擬公開徵求產學合作提案

✍ 對象：國內各大學教授

✍ 方式：若您對徵求提案之題目有興趣，歡迎於2021年10月6日(含)前填寫以下連結表單，我們會再寄送詳細資訊給您。

✍ 表單連結：https://bit.ly/3kSqynC

 

✍ 台積電2022年產學合作計畫 題目：

1. TSV loop charging reduction of SoIC for FEOL device I/O PID failure improvement

2. Polish wafer temperature distribution by different slurry fluid-field

3. Flow field simulation for EUV reticle and wafer defectivity improvement

4. Development of CIS characteristics monitor in WAT 1

5. Develop a new coating methodology or glue layer which can improve parts coating film adhesion on quartz parts

6. Stimulation plasma behavior and particulate motion to combine recipe machine auto learning

7. AlN/AlScN-based piezoelectric stack with multilayered cantilevers

8. The on-TDDB mechanism research for the gate oxide breakdown mode and lifetime prediction of high voltage device (DDD-MOS, LDMOS)

9. The power loss and Vswing analysis with TCAD circuit-device mix-mode simulation for the H-S and L-S device in the buck circuit for different frequency operation

10. Simultaneous double-side routing

11. 3D-ICs design partitioning and timing optimization

12. Computing architecture with Novel 3D Integration of compute and high-bandwidth memory for Machine Learning applications

13. Low voltage One-Time-Programmable (OTP) memory for HPC logic platform

14. Nano Diamond Abrasive to increase CMP productivity and performance

15. CMP slurry delivery system with zero agglomeration

16. Raman spectroscopy for non-destructive strain and defects measurements

17. Machine learning OCD with limited amount of references

18. Micro-arcing detection development for high density plasma etching process

19. To find a better methodology of defect sampling model through statistic and AI expertise

20. FINFET technology beyond 7nm - Novel Device Structure or WFM (Work Function Metal) film to avoid/minimize device impact by Oxidation

21. Lithography dissolution modelling

22. P-type channel TFT for monolithic 3D integrated BEOL CMOS

23. Novel doping in Hf-based FE film and optimum design of interfacial layer for high endurance operation

24. Optimization Ferroelectric(FE)/Oxide Semiconductor(OS) unit devices for high performance BEOL memory application

25. High order ECC codes

26. New many thread CPU architecture application base on large L3/system cache architecture of 3D IC

27. Binary Alloy

28. Nano-channels /air-gaps for nitrogen or other liquid cooling for stacks

 

✍ 免責聲明：

✒ 產學合作主題及其詳細資訊屬於台積公司智慧財產，僅供有興趣之教授申請台積電2022年產學合作計畫之個人使用，不得移作其他用途。

✒ 教授申請之產學合作計劃提案不可包含機密資訊；申請教授同意產學合作計劃提案不包含機密資訊，僅供台積公司內部產學合作計畫審核使用。

 

✍ 窗口：

潘小姐 03-563-6688 #752-3033

ycpann@tsmc.com

陳先生 03-563-6688 #707-2863/752-3006

hcchern@tsmc.com